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4PCS Universal BGA Reballing Stencil For MTK Huawei Xiaomi MSM CPU PM Power IC Planting Soldering Net

Selected market: Sri Lanka (LK)
2,151.80 LKR
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Service commitment
Shipping: 8.33 LKR
Delivery: Aug 17 - 19, item ships within 12 days
📦 Ships from: China (CN) → LK 🚚 Estimated delivery: 3 days
🌍 Route note: local import, VAT, customs or handling rules may apply according to the destination country.
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  • • Estimated delivery: 3.
  • • Strong customer signal: 4.7★ from 74 reviews.
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Product specifications

Brand
Kaisi
Sales
247
Package size
15 × 18 × 5 cm
Package weight
0.2 kg
Rating
4.7 / 5
Reviews
74
Color
Black

Detailed product description

This product is shown with available options, market-specific pricing and verified specifications.

Key information
  • Brand: Kaisi
  • Sales: 247
  • Package size: 15 × 18 × 5 cm
  • Package weight: 0.2 kg
  • Rating: 4.7 / 5

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4PCS Universal BGA Reballing Stencil For MTK Huawei Xiaomi MSM CPU PM Power IC Planting Soldering Net

Description

100% brand new and high quality.

Feature

These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.

High success rate of planting tin, the solder balls can be formed once when you are proficient.

Simple and convenient to use.

BGA Reballing Stencil only, other accessories demo in the picture is not included!

Specifications

Item Type: BGA Reballing Stencil

Material: Stainless Steel

Size: Standard Size

Color: Silver

Quantity: 4PCS

Note

No retail package.

Transition: 1cm=10mm=0.39inch

Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.

Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Package Includes

4 x BGA Reballing Stencils