27Pcs /16pcs/10pcs BGA general template Universal Direct Heated Stencils For SMT SMD Chip Rpair and easy support
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Product specifications
Detailed product description
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- Brand: NONE
- Sales: 63
- Package size: 10 × 10 × 10 cm
- Package weight: 0.05 kg
- Rating: 5.0 / 5
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Features
Made of imported stainless steel plate. Good stencil thickness.
Can be directly heated by air gun, steel mesh is not easy to deformation by heat.
Each set of 27 pieces. Basically covers the current common BGA chip.
Steel mesh area and BGA chip area matching, can reduce the waste of solder ball.
But for chip that solder balls uneven arranged or has different distance, please consider buying.
Universal direct heat BGA stencils for notebooks, desktops, XBOX, North and communications motherboards and other graphics cards and other types of BGA chip
10pcs stencils are as follows
1pc:0.3 universal stencil(P=0.58mm)
1pc:0.35 universal stencil(P=0.65mm)
1pc:0.4 universal stencil(P=0.7mm)
1pc:0.45 universal stencil(P=0.78mm)
1pc:0.5 universal stencil(P=0.8mm)
1pc:0.55 universal stencil(P=1.02mm)
3pc:0.6 universal stencil(P=0.9mm,P=1.0mm,P=1.1mm)
1pc:0.76 universal stencil(P=1.27mm)
16pcs stencils are as follows
1pc:0.35 universal stencil(P=0.6mm)
1pc:0.5 universal stencil(P=0.78mm)
2pc:0.6 universal stencil(P=0.9mm,P=1.1mm)
40mm*40mm
4pcs:0.6 universal stencil(P=0.99mm)
24mm*24mm 27mm*27mm 30mm*30mm 41mm*41mm
4pcs:0.76 universal stencil(P=1.27mm)
30mm*30mm 33mm*33mm 34mm*34mm 41mm*41mm
27pcs stencils are as follows
1pc:0.25 universal stencil(P=0.5mm)
1pc:0.3 universal stencil(P=0.5mm)
1pc:0.5 universal stencil(P=0.81mm)
1pc:0.65 universal stencil(P=1.0mm)
1pc:1.0 universal stencil(P=1.5mm)
5pcs:0.6 universal stencil(P=0.99mm)
24mm*24mm 27mm*27mm 30mm*30mm 33mm*33mm 41mm*41mm
5pcs:0.76 universal stencil(P=1.27mm)
30mm*30mm 33mm*33mm 34mm*34mm 37mm*37mm 41mm*41mm
Note
Better solder ball has normal content of tin and silver. Melting point is normal.
Direct heat with air gun, adjust the air gun temperature. No need too high temperature, otherwise cause deformation.