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MECHANIC HEAT AIR Intelligent Preheating Platform For iPhone X-16 PRO MAX Motherboard Layered Chip BGA Stencil/Dot Matrix Repair

MECHANIC HEAT AIR Intelligent Preheating Platform For iPhone X-16 PRO MAX Motherboard Layered Chip BGA Stencil/Dot Matrix Repair

Selected market: Romania (RO)
108.40 - 723.80 RON
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Shipping: 8.33 RON
Delivery: Aug 19 - 25, item ships within 12 days
📦 Ships from: China (CN) → RO 🚚 Estimated delivery: 7 days
🌍 Customs route note: this shipment comes from outside the EU. From 1 July 2026 to 1 July 2028, consignments with an intrinsic value up to €150 are subject to a temporary €3 customs duty for each different item category (tariff subheading); VAT or handling fees may also apply.
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Why this product fits your market

  • • Estimated delivery: 7.
  • • Strong customer signal: 4.9★ from 72 reviews.
  • • Recommendations focus on this product category and your market availability.

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Product specifications

Brand
MECHANIC
Sales
156
Package size
20 × 10 × 10 cm
Package weight
1.25 kg
Rating
4.9 / 5
Reviews
72
Color
12 Series module
Number of Pieces
110V
Number of Pieces
220V
Color
X-11 Series module
Color
iPhoneX-15 and host
Color
IPhone 15 module
Color
host
Color
IPhone 16 module
Color
iphone13 module
Color
iPhoneX-16 and host
Color
IPhone 14 module

Detailed product description

This product is shown with available options, market-specific pricing and verified specifications.

Key information
  • Brand: MECHANIC
  • Sales: 156
  • Package size: 20 × 10 × 10 cm
  • Package weight: 1.25 kg
  • Rating: 4.9 / 5

Before adding to cart, choose an available option and check the quantity.

Scope of application: latest support for IP X/XS/XS Max/11/11 Pro/11 Pro Max/12 mini/12/12 Pro/12 Pro Max /13 /13mini /13 Pro /13PROMAX/14 14mini 14 Pro 14PROMAX/15/ 15PIUS/ 15 Pro 15PROMAX/16/ 16PIUS/ 16 Pro 16PROMAX

motherboard layering. Fitting. Dot matrix repair

There is a protective film on the surface of the machine to prevent scratches. After receiving the package, you can tear off the protective film

Description

Specification

Name: Mechanic Heat Air Desoldering Station.

Input Voltage: AC100V/240V.

Output power: 600W.

Size: 178*101*45mm.

Temperature setting: 260℃.

Time setting: 10s-990s.

Packing list(standard): Host + Common module + power cord + box.

Optional

1. iPhone X-11 Pro Max heating module with 5pcs reballing stencil.

2. iPhone 12 series heating module with 3pcs reballing stencil.

3. iPhone 13 series heating module with 4pcs reballing stencil.

4. iPhone 14 series heating module with 3pcs reballing stencil

5. iPhone 15 series heating module with 2pcs reballing stencil.

6. iPhone 16 series heating module with 2pcs reballing stencil.

Feature

2. One key intelligent separation/bonding function. Safe and reliable,will not cause tin explosion phenomenon.

4. The intelligent temperature control system and high temperature protection function ensure that the motherboard will not be damaged during operation. To provide users with a safe and efficient heating experience.

8. The temperature is displayed in real time and can be adjusted with a stepless dial.

9. Can store three common memory temperatures and quickly switch to set temperatures.

10. One click to switch the memory temperature, double-click to enter the time setting, adjust the setting time through the knob.

11. Double-sided heat dissipation, stable and not hot.

12. Built for the motherboard, high temperature and no blocking, make maintenance work more convenient.

13. Modularization and unlimited upgrade expansion.

14. Boot current fault data storage, current curve fault analysis can be checked.