4 Stück Universelle BGA-Reballing-Schablonen für MTK Huawei Xiaomi MSM CPU PM Power IC Löt-Netz

Produktbeschreibung

4PCS Universal BGA Reballing Stencil For MTK Huawei Xiaomi MSM CPU PM Power IC Planting Soldering Net
Description
100% brand new and high quality.
Feature
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
BGA Reballing Stencil only, other accessories demo in the picture is not included!
Specifications
Item Type: BGA Reballing Stencil
Material: Stainless Steel
Size: Standard Size
Color: Silver
Quantity: 4PCS
Note
No retail package.
Transition: 1cm=10mm=0.39inch
Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Produktdetails in Bildern

Produkteigenschaften

Markenname

NONE

Abteilung

Unisex-Erwachsene

Ursprung

CN (Herkunft)

Material

Metall

Muster

andere

Hochbetriebenes Chemikalienunternehmen

Keine

Heimwerkerbedarf

elektrisch

Typ

Kombination

Paket

Tasche

Paket

Tasche

Anwendung

Technische InformatikBausatz

ist kundenspezifisch

Nein

Modellnummer

BGA Reballing Stencil

Größe

0.1

Choice

yes

semi_Choice

yes