Nc-559-asm Flussmittel-BGA-Kugeln, flüssiges Löten für Lötspritze, Lötpaste, 10 ml Flussmittel zum Löten, keine Reinigung, Schweißwerkzeuge

Produktbeschreibung

DSUNYK Nc-559-asm Flux Bga Balls,Liquid Solder for Soldering Syringe Solder Paste 10ml Flux for Soldering No cleaning Welding Tools
Item Specific
Capacity: 10ML
Brand:DSUNYK
Model: NC-559-ASM
Color: As shown
Suitable for BGA ball, semiconductor packaging, repair.
Computer motherboard north and south bridge, communications
graphics and other BGA apply.
Features
1: This product is no-clean solder paste, very little residue, without washing.
2: The residue is colorless and transparent appearance outstanding.
3: Excellent printing performance with suitable hand and machine print.
Is currently the best on the market BGA, CSP rework help paste.
Just apply a little each time
When the bumping of the BGA chip coated with flux paste and PCB pads are required coat
Good BGA soldering flux paste and machine regardless of manual welding
the success rate is greatly increased.
Nc-559-asm
Liquid Solder for Soldering

Produktdetails in Bildern

Produkteigenschaften

Markenname

DSUNYK

Hochbetriebenes Chemikalienunternehmen

Keine

Ursprung

CN (Herkunft)

Modellnummer

NC-559-ASM

Zertifizierung

Reichweite

Zertifizierung

RoHS-Konformität

Partikelgröße

10–25 μm

Main application

Surface welding aid for tin lead or tin silver copper alloys

Incompatible materials

Strong oxidants, acids, anhydrides, alkali metals, amines.

rosin

40-50 %

synthetic resin

<10 %

solvent

<30 %

thixotropic agent

<5 %

surfactant

<5%

surfactant

<3%

additive

<5%

Choice

yes